PDF Standards IEC 61192-2 Ed. 1.0 b:2003

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Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

Product Details

Edition:

1.0

Published:

03/14/2003

Number of Pages:

127

File Size:

1 file , 5.8 MB

Note:

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