Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
standard by Association Connecting Electronics Industries, 09/01/1988

IPC APEX 2019 Technical Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 04/11/2019

Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/01/2003

Reflow Oven Process Control Standard
standard by Association Connecting Electronics Industries, 08/01/2022

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
standard by Association Connecting Electronics Industries, 09/01/2004

Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs – Includes addenda I and II
standard by Association Connecting Electronics Industries, 03/01/1991

Design and Assembly Process Implementation for BGAs, Includes Amendment 1
standard by Association Connecting Electronics Industries, 06/01/2019

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014

Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 03/01/2018

Rework, Modification and Repair of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2017