IPC APEX 2019 Technical Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 04/11/2019

Printed Wiring Board Strain Gage Test Guideline
standard by Association Connecting Electronics Industries, 06/01/2005

Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/01/2003

Reflow Oven Process Control Standard
standard by Association Connecting Electronics Industries, 08/01/2022

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2006

Sectional Standard on Rigid PWB Design
standard by Association Connecting Electronics Industries, 03/01/1998

Printed Board Automated Assembly Description in Digital Form
standard by Association Connecting Electronics Industries, 01/01/1995

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
standard by Association Connecting Electronics Industries, 09/01/2004

Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs – Includes addenda I and II
standard by Association Connecting Electronics Industries, 03/01/1991

Design and Assembly Process Implementation for BGAs, Includes Amendment 1
standard by Association Connecting Electronics Industries, 06/01/2019