Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 07/27/2021

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
standard by Association Connecting Electronics Industries, 12/01/2018

Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology
standard by Association Connecting Electronics Industries, 03/01/2000

Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2020

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
standard by Association Connecting Electronics Industries,

Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 08/01/2004

Sectional Design Standard for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2011

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 11/01/1999

Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014