PDF Standards IPC TR 585
Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006
Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006
TMRC 1999 Market for Flexible Circuits
Report / Survey by Association Connecting Electronics Industries, 06/27/2000
Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring
standard by Association Connecting Electronics Industries, 06/01/2016
Cleaning and Cleanliness Test Program Phase 1 Test Results
standard by Association Connecting Electronics Industries, 10/01/1989
Specification for Immersion Silver Plating for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2009
Ten-Layer Multi Artwork – D-350 Format
standard by Association Connecting Electronics Industries,
Requirements and Acceptance for Cable and Wire Harness Assemblies
standard by Association Connecting Electronics Industries, 01/01/2020
Bare Substrate Electrical Test Data Format
standard by Association Connecting Electronics Industries, 10/01/2002
Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2014
Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 01/20/2020