Design and Assembly Process Implementation for Flip Chip and Die-Size Components
standard by Association Connecting Electronics Industries, 01/01/2018

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 05/01/2015

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/31/2017

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2022

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2016

Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 04/01/2016

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2
standard by Association Connecting Electronics Industries, 10/01/2002

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 09/01/2020

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2021

Cleaning Alternatives Artwork – Gerber Format
standard by Association Connecting Electronics Industries,