PDF Standards IPC 6013C
Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries,
Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries,
Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 01/01/2013
TMRC Technology Trends for Rigid Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 06/27/2000
Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 07/01/2022
Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010
Design and Assembly Process Implementation for Flip Chip and Die Size Components
standard by Association Connecting Electronics Industries, 02/01/2009
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
standard by Association Connecting Electronics Industries, 05/01/2002
Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013
Performance guide Manual for single- and double-sided flexible printed wiring boards
standard by Association Connecting Electronics Industries, 10/01/1999
The Global Standard for Machine-to-Machine Communication in SMT Assembly Version 1.4
standard by Association Connecting Electronics Industries, 02/01/2022