Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1
standard by Association Connecting Electronics Industries, 07/01/2015

Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries,

Design and Assembly Process Implementation for Flip Chip and Die Size Components
standard by Association Connecting Electronics Industries, 02/01/2009

TMRC Technology Trends for Rigid Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 06/27/2000

Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 07/01/2022

Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010

Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2005

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
standard by Association Connecting Electronics Industries, 05/01/2002

Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013