National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999

Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 01/01/2002

Library Format Description for Printed Boards in Digital Form
standard by Association Connecting Electronics Industries, 02/01/1987

Implementation of Ball Grid Array and Other High Density Technology
standard by Association Connecting Electronics Industries, 08/01/1996

Ten-Layer Multi Artwork – Gerber Format
standard by Association Connecting Electronics Industries,

Specifications for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 12/10/1997

Mechanical Shock Test Guidelines for Solder Joint Reliability
standard by Association Connecting Electronics Industries, 03/01/2009

Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 01/01/2013

SMT Assembly Benchmark Artwork – Gerber Format
standard by Association Connecting Electronics Industries,

Metal Foil for Printed Board Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2016