PDF Standards IPC 9706
Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013
Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 02/01/2003
Component Identification for Through Hole and Surface Mount
Training Material by Association Connecting Electronics Industries, 07/01/2002
Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 01/01/2020
Documentation Requirements for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/1995
Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 09/01/2017
Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
standard by Association Connecting Electronics Industries, 07/01/1993
Design, Critical Process and Acceptance Requirements for Polymeric Applications
standard by Association Connecting Electronics Industries, 07/01/2022
Sectional Design Standard for High Density Interconnect (HDI) Boards
standard by Association Connecting Electronics Industries, 05/01/2003
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 06/01/2013