Surface Mount Land Pattern Round Robin Artwork
standard by Association Connecting Electronics Industries,

Troubleshooting for Printed Board Fabrication Processes
standard by Association Connecting Electronics Industries, 02/01/2016

Guidelines for Multichip Module Technology Utilization
standard by Association Connecting Electronics Industries, 08/01/1992

Requirements and Acceptance for Cable and Wire Harness Assemblies
standard by Association Connecting Electronics Industries, 07/01/2006

Fine Line Round Robin Test Pattern
standard by Association Connecting Electronics Industries, 09/01/1984

Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 02/02/2020

Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 11/01/2011

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 02/01/2022

2000 Analysis for Rigid Printed Wiring Boards and Related Materials
Report / Survey by Association Connecting Electronics Industries, 01/01/2000

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2
standard by Association Connecting Electronics Industries, 12/01/2012