Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018

Sectional Design Standard for Rigid Organic Printed Boards
standard by Association Connecting Electronics Industries, 10/01/2020

Conflict Minerals Data Exchange Standard
Amendment by Association Connecting Electronics Industries, 05/08/2017

Results of Multilayer Test Program Round Robin
standard by Association Connecting Electronics Industries, 04/01/1981

Design Guide for the Packaging of High Speed Electronic Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003

Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries,

Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 03/01/2019

Acceptability of Electronic Assemblies – Incorporates Amendment 1
standard by Association Connecting Electronics Industries, 02/01/2016

An In-Depth Look At Ionic Cleanliness Testing
standard by Association Connecting Electronics Industries, 07/01/2002

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 06/01/2013