Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
standard by International Electrotechnical Commission, 05/23/2017

Maritime navigation and radiocommunication equipment and systems – Digital interfaces – Part 1: Single talker and multiple listeners
standard by International Electrotechnical Commission, 07/07/2000

Composite insulators for a.c. overhead lines with a nominal voltage greater than 1000 V – Definitions, test methods and acceptance criteria
standard by International Electrotechnical Commission, 03/31/1992

Delay and power calculation standards – Part 3: Standard Delay Format (SDF) for the electronic design process
standard by International Electrotechnical Commission, 09/24/2004

Maritime navigation and radiocommunication equipment and systems – Digital interfaces – Part 420: Multiple talkers and multiple listeners – Ship systems interconnection – Companion standard requirements and basic companion standards
standard by International Electrotechnical Commission, 11/28/2001

Rectangular connectors for frequencies below 3 MHz – Part 2: Detail specification for a range of connectors, with assessed quality, with trapezoidal shaped metal shells and round contacts – Fixed solder contact types
standard by International Electrotechnical Commission, 11/13/1992

Function blocks – Part 1: Architecture
standard by International Electrotechnical Commission, 11/07/2012

Radio-frequency connectors – Part 24: Sectional specification – Radio frequency coaxial connectors with screw coupling, typically for use in 75 Ω cable networks (type F)
standard by International Electrotechnical Commission, 02/23/2009

Industrial communication networks – Fieldbus specifications – Part 6-20: Application layer protocol specification – Type 20 elements
standard by International Electrotechnical Commission, 12/14/2007

Optical fibre cables – Part 2-42: Indoor optical fibre cables – Product specification for simplex and duplex cables with A4 fibres
standard by International Electrotechnical Commission, 04/09/2008