Integrated circuits – EMC evaluation of transceivers – Part 2: LIN transceivers
standard by International Electrotechnical Commission, 11/18/2016

Semiconductor devices – Micro-electromechanical devices – Part 14: Forming limit measuring method of metallic film materials
standard by International Electrotechnical Commission, 02/28/2012

Connectors – Safety requirements and tests
standard by International Electrotechnical Commission, 06/20/2001

Communication networks and systems for power utility automation – Part 7-4: Basic communication structure – Compatible logical node classes and data object classes
standard by International Electrotechnical Commission, 03/31/2010

Fibre optic interconnecting devices and passive components – Fibre optic connector interfaces – Part 24: Type SC-RJ connector family
standard by International Electrotechnical Commission, 09/30/2009

Industrial communication networks – Fieldbus specifications – Part 6-16: Application layer protocol specification – Type 16 elements
standard by International Electrotechnical Commission, 12/14/2007

Maintainability of equipment – Part 3: Verification and collection, analysis and presentation of data
standard by International Electrotechnical Commission, 04/27/2006

Rectangular connectors for frequencies below 3 MHz – Part 1:Generic specification – General requirements and guide for thepreparation of detail specifications for connectors with assessedquality
standard by International Electrotechnical Commission, 10/15/1991

Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS – Part 5: D-VHS
standard by International Electrotechnical Commission, 04/07/2004

Semiconductor devices – Mechanical and climatic test methods – Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
standard by International Electrotechnical Commission, 07/21/2016