Maintainability of equipment – Part 3: Verification and collection, analysis and presentation of data
standard by International Electrotechnical Commission, 04/27/2006

Industrial communication networks – Profiles – Part 3-2: Functional safety fieldbuses – Additional specifications for CPF 2
standard by International Electrotechnical Commission, 07/13/2016

Rectangular connectors for frequencies below 3 MHz – Part 1:Generic specification – General requirements and guide for thepreparation of detail specifications for connectors with assessedquality
standard by International Electrotechnical Commission, 10/15/1991

Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS – Part 5: D-VHS
standard by International Electrotechnical Commission, 04/07/2004

Semiconductor devices – Mechanical and climatic test methods – Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
standard by International Electrotechnical Commission, 07/21/2016

Semiconductor devices – Discrete devices and integrated circuits – Part 2: Rectifier diodes
standard by International Electrotechnical Commission, 03/21/2000

Function blocks – Part 1: Architecture
standard by International Electrotechnical Commission, 01/24/2005

Fixed inductors for electromagnetic interference suppression – Part 1: Generic specification
standard by International Electrotechnical Commission, 10/29/1999

Warning equipment for criticality accidents
standard by International Electrotechnical Commission, 06/15/1987

Secondary cells and batteries containing alkaline or other non-acid electrolytes – Nickel-cadmium prismatic secondary single cells with partial gas recombination
standard by International Electrotechnical Commission, 10/28/2003