PDF Standards IEC 61120-3 Ed. 1.0 b:1991
Digital audio tape recorder reel to reel system, using 6.3 mm magnetic tape, for professional use – Part 3: Format B
standard by International Electrotechnical Commission, 11/15/1991
Digital audio tape recorder reel to reel system, using 6.3 mm magnetic tape, for professional use – Part 3: Format B
standard by International Electrotechnical Commission, 11/15/1991
Connectors for use in d.c. low-frequency analogue and digital high speed data applications – Part 4-103: Printed board connectors with assessed quality – Detail specification for two-part connectors with shielding and a basic grid of 2,5 mm
standard by International Electrotechnical Commission, 02/26/1999
Low-voltage switchgear and controlgear – Part 1: General rules CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 09/09/2014
Cable networks for television signals, sound signals and interactiveservices – Part 7-1: Hybrid Fibre Coax Outside Plant status monitoring – Physical (PHY) layer specification CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 04/29/2015
Switches for household and similar fixed-electrical installations – Part 1: General requirements CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 01/31/2007
Standard for automatic test markup language (ATML) test configuration
standard by International Electrotechnical Commission, 04/08/2016
Audio and audiovisual equipment – Digital audio parts – Basic measurement methods of audio characteristics – Part 1: General
standard by International Electrotechnical Commission, 10/10/2003
Insulators for overhead lines with a nominal voltage above 1000 V – Ceramic or glass insulator units for d.c. systems – Definitions, test methods and acceptance criteria
standard by International Electrotechnical Commission, 03/29/1995
Low-voltage switchgear and controlgear – Part 5-1: Control circuit devices and switching elements – Electromechanical control circuit devices CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/08/2009
Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge
standard by International Electrotechnical Commission, 07/13/2011