Fixed capacitors for use in electronic equipment – Part 6: Sectional specification – Fixed metallized polycarbonate film dielectric d.c. capacitors
standard by International Electrotechnical Commission, 09/26/2005
Fibre optic interconnecting devices and passive components performance standard – Part 1: General and guidance for performance standards
standard by International Electrotechnical Commission, 03/12/2008
Functional safety of electrical/electronic/programmable electronic safety-related systems – Part 6: Guidelines on the application of IEC 61508-2 and IEC 61508-3
standard by International Electrotechnical Commission, 04/18/2000
Materials for printed boards and other interconnecting structures – Part 2-35: Reinforced base materials, clad and unclad – Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
standard by International Electrotechnical Commission, 11/27/2008
Live working – Saddles, stick clamps and their accessories
standard by International Electrotechnical Commission, 10/27/2010
Industrial communication networks – Fieldbus specifications – Part 6-21: Application layer protocol specification – Type 21 elements
standard by International Electrotechnical Commission, 06/20/2019
Industrial communication networks – Fieldbus specifications – Part 5-16: Application layer service definition – Type 16 elements
standard by International Electrotechnical Commission, 12/14/2007
Circuit-breakers for overcurrent protection for household and similar installations – Part 2: Circuit-breakers for a.c. and d.c. operation CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/24/2003
Automatic electrical controls for household and similar use – Part 2-6: Particular requirements for automatic electrical pressure sensing controls including mechanical requirements
standard by International Electrotechnical Commission, 02/15/2007
Semiconductor devices – Micro-electromechanical devices – Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
standard by International Electrotechnical Commission, 09/13/2011
