Connectors for frequencies below 3 MHz for use with printed boards. Part 9: Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2.54 mm (0.1 in)
standard by International Electrotechnical Commission, 11/30/1990
Tests for electric cables under fire conditions – Circuit integrity – Part 2: Test method for fire with shock at a temperature of at least 830 °C for cables of rated voltage up to and including 0,6/1,0 kV and with an overall diameter not exceeding 20 mm
standard by International Electrotechnical Commission, 05/19/2009
Standard for automatic test markup language (ATML) test station description
standard by International Electrotechnical Commission, 04/08/2016
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 5-503: General test method for materials and assemblies – Conductive anodic filaments (CAF) testing of circuit boards
standard by International Electrotechnical Commission, 05/22/2017
Industrial communication networks – Fieldbus specifications – Part 4-21: Data-link layer protocol specification – Type 21 elements
standard by International Electrotechnical Commission, 04/10/2019
Fire hazard testing – Part 11-2: Test flames – 1 kW pre-mixed flame – Apparatus, confirmatory test arrangement and guidance
standard by International Electrotechnical Commission, 06/08/2017
Medical electrical equipment – Dose area product meters
standard by International Electrotechnical Commission, 11/12/2019
Underwater acoustics – Hydrophones – Properties of hydrophones in the frequency range 1 Hz to 500 kHz
standard by International Electrotechnical Commission, 04/10/2017
Specifications for particular types of winding wires – Part 0-9: General requirements – Enamelled rectangular aluminium wire
standard by International Electrotechnical Commission, 05/05/2015
Electrostatics – Part 4-4: Standard test methods for specific applications – Electrostatic classification of flexible intermediate bulk containers (FIBC)
standard by International Electrotechnical Commission, 10/13/2005
