Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guidelines for fine-pitch land grid array (FLGA)
standard by International Electrotechnical Commission, 06/08/2011
Insulated bushings for alternating voltages above 1 000 V
standard by International Electrotechnical Commission, 07/25/2008
Industrial communication networks – Fieldbus specifications – Part 4-3: Data-link layer protocol specification – Type 3 elements
standard by International Electrotechnical Commission, 08/05/2010
Semiconductor devices – Discrete devices – Part 4: Microwave diodes and transistors CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 01/30/2017
Cable networks for television signals, sound signals and interactive services – Part 113: Optical systems for broadcast signal transmissions loaded with digital channels only
standard by International Electrotechnical Commission, 07/10/2018
Measuring relays and protection equipment – Part 181: Functional requirements for frequency protection
standard by International Electrotechnical Commission, 02/27/2019
Electrostatics – Part 4-7: Standard test methods for specific applications – Ionization
standard by International Electrotechnical Commission, 01/14/2010
Fibre optic interconnecting devices and passive components – Performance standard – Part 031-6: Non-connectorized single-mode 1¿¿N and 2¿¿N non-wavelength-selective branching devices for Category O – Uncontrolled environment
standard by International Electrotechnical Commission, 09/03/2014
Thermoluminescence dosimetry systems for personal and environmental monitoring
standard by International Electrotechnical Commission, 06/26/2006
Electrical equipment for measurement, control and laboratory use – EMC requirements – Part 2-5: Particular requirements – Test configurations, operational conditions and performance criteria for field devices with field bus interfaces according to IEC 61784-1
standard by International Electrotechnical Commission, 10/02/2012
