Optical fibres – Part 2-10: Product specifications – Sectional specification for category A1 multimode fibres
standard by International Electrotechnical Commission, 06/05/2007

Semiconductor devices – Discrete devices – Part 7: Bipolar transistors
standard by International Electrotechnical Commission, 09/23/2019

Connectors for frequencies below 3 MHz for use with printed boards – Part 1: Generic specification – General requirements and guide for the preparation of detail specifications, with assessed quality
standard by International Electrotechnical Commission, 06/28/1991

Tests for electric cables under fire conditions – Circuit integrity – Part 3: Test method for fire with shock at a temperature of at least 830 ¿¿C for cables of rated voltage up to and including 0,6/1,0 kV tested in a metal enclosure
standard by International Electrotechnical Commission, 03/28/2018

Measurement of the electrical properties of microwave tubes – Part 2: General measurements
standard by International Electrotechnical Commission, 01/01/1972

Magnetic tape sound recording and reproducing systems. Part 5: Electrical magnetic tape properties
standard by International Electrotechnical Commission, 03/15/1988

Industrial communication networks – Fieldbus specifications – Part 6-18: Application layer protocol specification – Type 18 elements
standard by International Electrotechnical Commission, 08/06/2010

VMEbus – Microprocessor system bus for 1 byte to 4 byte data
standard by International Electrotechnical Commission, 12/17/1991

Safety requirements for electrical equipment for measurement, control, and laboratory use – Part 2-032: Particular requirements for hand-held and hand-manipulated current sensors for electrical test and measurement
standard by International Electrotechnical Commission, 09/30/2002

Semiconductor devices – Integrated circuits – Part 2-11: Digital integrated circuits – Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
standard by International Electrotechnical Commission, 04/12/1999