Household and similar electrical appliances – Safety – Part 2-17: Particular requirements for blankets, pads, clothing and similar flexible heating appliances CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 10/14/2009

Rubber insulated cables – Rated voltages up to and including 450/750 V – Part 8: Cords for applications requiring high flexibility CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 01/29/2004

Printed boards – Electronic data description and transfer – Part 1: Printed board description in digital form
standard by International Electrotechnical Commission, 09/09/1994

Electromagnetic compatibility (EMC) – Part 4-20: Testing and measurement techniques – Emission and immunity testing in transverse electromagnetic (TEM) waveguides
standard by International Electrotechnical Commission, 01/29/2003

Cable networks for television signals, sound signals and interactive services – Part 4: Passive wideband equipment for coaxial cable networks
standard by International Electrotechnical Commission, 08/10/2007

Guide to dynamic measurements of piezoelectric ceramics with high electromechanical coupling
standard by International Electrotechnical Commission, 01/01/1976

Electrical insulating materials – Thermal endurance properties – Part 6: Determination of thermal endurance indices (TI and RTE) of an insulating material using the fixed time frame method
standard by International Electrotechnical Commission, 05/29/2006

Safety of machinery – Electro-sensitive protective equipment – Part 1: General requirements and tests CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 01/22/2008

Classification of environmental conditions – Part 3-7: Classification of groups of environmental parameters and their severities – Portable and non-stationary use CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 10/24/2002

Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
standard by International Electrotechnical Commission, 09/29/2004