OPC unified architecture – Part 12: Discovery and global services
standard by International Electrotechnical Commission, 06/16/2020

Industrial-process control valves – Part 2-3: Flow capacity – Test procedures
standard by International Electrotechnical Commission, 12/16/2015

Information technology — Telecommunications and information exchange between systems — Private Integrated Services Network — Mapping functions for the employment of 64 kbit/s circuit mode connections with 8 kbit/s sub-multiplexing
standard by International Electrotechnical Commission, 10/10/2000

OPC Unified Architecture – Part 11: Historical Access
standard by International Electrotechnical Commission, 06/23/2020

Industrial communication networks – Fieldbus specifications – Part 4-12: Data-link layer protocol specification – Type 12 elements
standard by International Electrotechnical Commission, 04/18/2019

Lamps, light sources and LED packages for road vehicles – Performance requirements CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 04/08/2019

Degrees of protection provided by enclosures (IP Code) CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 08/29/2013

Mechanical standardization of semiconductor devices – Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
standard by International Electrotechnical Commission, 04/23/1997

Fixed resistors for use in electronic equipment. Part 7: Sectional specification: Fixed resistor networks in which not all resistors are individually measurable
standard by International Electrotechnical Commission, 12/30/1984

International Electrotechnical Vocabulary (IEV) – Part 815: Superconductivity
standard by International Electrotechnical Commission, 11/04/2015