High-voltage test techniques – Part 1: General definitions and test requirements
standard by International Electrotechnical Commission, 09/29/2010

Solderless connections – Part 3: Accessible insulation displacement (ID) connections – General requirements, test methods and practical guidance
standard by International Electrotechnical Commission, 04/09/2020

Methods of measurement for equipment used in terrestrial radio-relay systems – Part 3: Simulated systems – Section Three: Measurements for monochrome and colour television transmission
standard by International Electrotechnical Commission, 01/01/1981

Household and similar electrical appliances – Safety – Part 2-9: Particular requirements for grills, toasters and similar portable cooking appliances
standard by International Electrotechnical Commission, 07/25/2008

Safety requirements for radio transmitting equipment
standard by International Electrotechnical Commission, 06/15/1987

Measurements of the electrical properties of electronic tubes – Part 25: Methods of measurement of Geiger-M¿¿ller counter tubes
standard by International Electrotechnical Commission, 01/01/1971

Industrial communication networks – Fieldbus specifications – Part 4-12: Data-link layer protocol specification – Type 12 elements
standard by International Electrotechnical Commission, 04/18/2019

Tests on electric and optical fibre cables under fire conditions – Part 3-10: Test for vertical flame spread of vertically-mounted bunched wires or cables – Apparatus
standard by International Electrotechnical Commission, 07/13/2018

Insulating liquids – Measurement of relative permittivity, dielectric dissipation factor (tan d) and d.c. resistivity
standard by International Electrotechnical Commission, 02/06/2004

Mechanical standardization of semiconductor devices – Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for stacked packages – Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
standard by International Electrotechnical Commission, 01/27/2011