PDF Standards IEC 61188-5-2 Ed. 1.0 b:2003

Click here to purchase
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Product Details

Edition:

1.0

Published:

06/24/2003

Number of Pages:

103

File Size:

1 file , 1.3 MB

Note:

This product is unavailable in Ukraine, Russia, Belarus