PDF Standards IEC 61188-5-6 Ed. 1.0 b:2003

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Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

Product Details

Edition:

1.0

Published:

01/23/2003

Number of Pages:

37

File Size:

1 file , 380 KB

Note:

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